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Lead Free Solder, Sn96.5% / Ag3% / Cu0.5%

Lead Free Solder, Sn96.5% / Ag3% / Cu0.5%

Lead free solder. Uses JEITA recommended alloys.

[Features]
· Features low-spatter flux.
· A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.

PDF

Japanese Only

Part Number

Configured Part Number is shown.

 
Part Number
HS-301
HS-302
HS-304
HS-312
HS-313
HS-314
HS-316
HS-317
HS-361
HS-363
Part NumberStandard Unit PriceMinimum order quantityVolume DiscountDays to ShipRoHSType Wire diameter
(φ/mm)

792,000 IDR

1 Piece(s) 1 Day(s) -Bobbin type M0.3

624,462 IDR

1 Piece(s) 1 Day(s) -Bobbin type M0.6

339,408 IDR

1 Piece(s) 9 Day(s) or more 10Bobbin type M1.0

1,866,770 IDR

1 Piece(s) Quote -Bobbin type L0.6

1,298,442 IDR

1 Piece(s) 9 Day(s) or more 10Bobbin type L0.8

1,683,077 IDR

1 Piece(s) Quote -Bobbin type L1.0

4,907,693 IDR

1 Piece(s) Quote -Bobbin type LL0.8

3,830,429 IDR

1 Piece(s) 12 Day(s) -Bobbin type LL1.0

241,539 IDR

1 Piece(s) Quote -Bobbin type S0.6

240,000 IDR

1 Piece(s) Quote -Bobbin type S1.0

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Basic Information

Lead Free Corresponds to Material Sn96.5%/Ag3%/Cu0.5%

Tech Support

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